Invention Grant
- Patent Title: Pressure array sensor module and manufacturing method thereof
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Application No.: US14573725Application Date: 2014-12-17
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Publication No.: US09784626B2Publication Date: 2017-10-10
- Inventor: Chang-Yi Chen , Jui-Yiao Su , Yan-Chen Liu , Chang-Ho Liou
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW103134541A 20141003
- Main IPC: G01L1/00
- IPC: G01L1/00 ; G01L17/00

Abstract:
A pressure array sensor module, comprising an array electrode board, a plurality of pressure sensing elements, at least one first conductive structure and at least one second conductive structure is provided. The array electrode board comprises a substrate and an electrode array disposed on the substrate and having a first electrode pattern and a second electrode pattern. Each pressure sensing element is disposed at a sensing position on the array electrode board, and comprises a top electrode layer, a bottom electrode layer and at least one pressure sensing layer disposed between the top electrode layer and the bottom electrode layer. The top electrode layer has a first lead. The bottom electrode layer has a second lead. The first conductive structure electrically connects the first lead and the corresponding first electrode pattern. The second conductive structure electrically connects the second lead and the corresponding second electrode pattern.
Public/Granted literature
- US20160097688A1 PRESSURE ARRAY SENSOR MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-04-07
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