A substrate treatment method is performed by a substrate treatment apparatus including a substrate holding unit which holds a substrate, and a hot plate which heats the substrate from below. The method includes: a treatment liquid supplying step of locating the hot plate at a retracted position at which the hot plate is retracted below the substrate holding unit and, in this state, supplying a treatment liquid to an upper surface of the substrate held by the substrate holding unit; a protection liquid film forming step of forming a liquid film of a protection liquid to cover an upper surface of the hot plate in the treatment liquid supplying step; and a substrate heating step of heating the substrate by the hot plate with the hot plate being located adjacent to a lower surface of the substrate or in contact with the lower surface of the substrate.