Invention Grant
- Patent Title: Fabricating a dual gate stack of a CMOS structure
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Application No.: US15040303Application Date: 2016-02-10
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Publication No.: US09786664B2Publication Date: 2017-10-10
- Inventor: Lukas Czornomaz , Veeresh Vidyadhar Deshpande , Vladimir Djara , Jean Fompeyrine
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Harrington & Smith
- Main IPC: H01L21/8239
- IPC: H01L21/8239 ; H01L27/092 ; H01L29/201 ; H01L29/161 ; H01L21/8238 ; H01L21/02 ; H01L29/66

Abstract:
A dual gate CMOS structure including a semiconductor substrate; a first channel structure including a first semiconductor material and a second channel structure including a second semiconductor material on the substrate. The first semiconductor material including SixGe1-x where x=0 to 1 and the second semiconductor material including a group III-V compound material. A first gate stack on the first channel structure includes: a first native oxide layer as an interface control layer, the first native oxide layer comprising an oxide of the first semiconductor material; a first high-k dielectric layer; a first metal gate layer. A second gate stack on the second channel structure includes a second high-k dielectric layer; a second metal gate layer. The interface between the second channel structure and the second high-k dielectric layer is free of any native oxides of the second semiconductor material.
Public/Granted literature
- US20170229460A1 Fabricating a Dual Gate Stack of a CMOS Structure Public/Granted day:2017-08-10
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