Invention Grant
- Patent Title: Uplink ACK/NACK bundling enhancement for LTE TDD enhanced interference management and traffic adaptation
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Application No.: US14421130Application Date: 2013-09-12
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Publication No.: US09787437B2Publication Date: 2017-10-10
- Inventor: Minghai Feng , Jiming Guo , Neng Wang , Jilei Hou , Hao Xu , Peter Gaal
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox, LLP
- Priority: WOPCT/CN2012/081410 20120914
- International Application: PCT/CN2013/083390 WO 20130912
- International Announcement: WO2014/040546 WO 20140320
- Main IPC: H04L1/16
- IPC: H04L1/16 ; H04L5/14 ; H04W72/04 ; H04L1/18 ; H04L1/06
Abstract:
A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus groups subframes of a time division duplex (TDD) configuration of a serving cell into a set of anchor subframes and a set of non-anchor subframes. The apparatus also separately bundles positive acknowledgements (ACKs) and/or negative acknowledgements (NACKs) of the anchor subframes, and ACKs and/or NACKs of the non-anchor subframes.
Public/Granted literature
- US20150229446A1 UPLINK ACK/NACK BUNDLING ENHANCEMENT FOR LTE TDD ENHANCED INTERFERENCE MANAGEMENT AND TRAFFIC ADAPTATION Public/Granted day:2015-08-13
Information query
