Invention Grant
- Patent Title: Interposer with beyond reticle field conductor pads
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Application No.: US15007791Application Date: 2016-01-27
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Publication No.: US09806014B2Publication Date: 2017-10-31
- Inventor: Michael S. Alfano , Bryan Black , Michael Z. Su , Joseph R. Siegel , Julius E. Din , Anwar Kashem
- Applicant: Michael S. Alfano , Bryan Black , Michael Z. Su , Joseph R. Siegel , Julius E. Din , Anwar Kashem
- Applicant Address: US CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Timothy M. Honeycutt
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/498 ; H01L21/48 ; H01L23/00
Abstract:
Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a first side and a second side opposite the first side. The first side has a first reticle field and a second reticle field larger than the first reticle field. Plural conductor pads are positioned on the first side in the first reticle field. Plural dummy conductor pads are positioned on the first side in the second reticle field and outside the first reticle field.
Public/Granted literature
- US20170213787A1 INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS Public/Granted day:2017-07-27
Information query
IPC分类:
