Invention Grant
- Patent Title: Semiconductor package assembly with passive device
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Application No.: US15012018Application Date: 2016-02-01
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Publication No.: US09818727B2Publication Date: 2017-11-14
- Inventor: Che-Hung Kuo , Ying-Chih Chen , Che-Ya Chou
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L25/16 ; H01L23/31 ; H01L23/00
Abstract:
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first substrate. A first semiconductor die is disposed on the first substrate. A passive device is located directly on the first semiconductor die. The passive device is disposed within a boundary of the first semiconductor die in a plan view.
Public/Granted literature
- US20160268233A1 SEMICONDUCTOR PACKAGE ASSEMBLY WITH PASSIVE DEVICE Public/Granted day:2016-09-15
Information query
IPC分类:
