Invention Grant
- Patent Title: Method of manufacturing an imaging device
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Application No.: US15054677Application Date: 2016-02-26
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Publication No.: US09831284B2Publication Date: 2017-11-28
- Inventor: Keiji Mabuchi , Hideshi Abe , Hideo Kanbe , Shiro Uchida
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-228328 20131101
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G01J5/20 ; G01J3/28 ; G01J3/36
Abstract:
A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.
Public/Granted literature
- US20160181305A1 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS Public/Granted day:2016-06-23
Information query
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