Invention Grant
- Patent Title: Spin dispenser module substrate surface protection system
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Application No.: US14179337Application Date: 2014-02-12
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Publication No.: US09855579B2Publication Date: 2018-01-02
- Inventor: Ching-Hai Yang , Yao-Hwan Kao , Shang-Sheng Li , Kuo-Pin Chen , Hsiang-Kai Tseng , Chuan-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee: Taiwan Semiconductor Manufacturing Company
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: B05C11/10
- IPC: B05C11/10 ; B05C11/08 ; B05B11/00 ; G03F7/16 ; G03F7/30 ; H01L21/67

Abstract:
A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.
Public/Granted literature
- US20150224532A1 Spin Dispenser Module Substrate Surface Protection System Public/Granted day:2015-08-13
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