Invention Grant
- Patent Title: LED module and method of bonding thereof
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Application No.: US14549596Application Date: 2014-11-21
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Publication No.: US09857063B2Publication Date: 2018-01-02
- Inventor: Wei-Yu Yeh
- Applicant: EPISTAR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: Epistar Corporation
- Current Assignee: Epistar Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V19/00 ; H05K3/00 ; F21V29/70 ; B23K20/00 ; B23K20/10 ; H05K1/02 ; H05K1/05 ; B23K101/36
Abstract:
The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board.
Public/Granted literature
- US20150078014A1 LED MODULE AND METHOD OF BONDING THEREOF Public/Granted day:2015-03-19
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