Invention Grant
- Patent Title: Method for electroless metallization
-
Application No.: US14042527Application Date: 2013-09-30
-
Publication No.: US09863044B2Publication Date: 2018-01-09
- Inventor: Maria Anna Rzeznik , Philip D. Knudsen , Xuesong Wang , Martin W. Bayes , Yuhsin Tsai
- Applicant: Rohm and Haas Electronic Materials LLC
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent John J. Piskorski
- Main IPC: B05D3/10
- IPC: B05D3/10 ; C23C18/18 ; C09D179/02 ; C23C18/16 ; C08G12/00 ; C23C18/40

Abstract:
A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.
Public/Granted literature
- US20140093647A1 METHOD FOR ELECTROLESS METALLIZATION Public/Granted day:2014-04-03
Information query