Invention Grant
- Patent Title: Group 13 nitride composite substrate semiconductor device, and method for manufacturing group 13 nitride composite substrate
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Application No.: US14657704Application Date: 2015-03-13
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Publication No.: US09882042B2Publication Date: 2018-01-30
- Inventor: Yoshitaka Kuraoka , Mikiya Ichimura , Makoto Iwai
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Aichi
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Aichi
- Agency: Cermak Nakajima & McGowan LLP
- Agent Tomoko Nakajima
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/778 ; H01L29/66 ; H01L29/20 ; H01L29/10 ; H01L29/201 ; H01L29/205 ; H01L29/207

Abstract:
Provided are a group 13 nitride composite substrate allowing for the production of a semiconductor device suitable for high-frequency applications while including a conductive GaN substrate, and a semiconductor device produced using this substrate. The group 13 nitride composite substrate includes a base material of an n-conductivity type formed of GaN, a base layer located on the base material, being a group 13 nitride layer having a resistivity of 1×106 Ω·cm or more, a channel layer located on the base layer, being a GaN layer having a total impurity density of 1×1017/cm3 or less, and a barrier layer that is located on the channel layer and is formed of a group 13 nitride having a composition AlxInyGa1−x−yN (0≦x≦1, 0≦y≦1).
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