Invention Grant
- Patent Title: MEMS sensor package systems and methods
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Application No.: US14136199Application Date: 2013-12-20
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Publication No.: US09884757B2Publication Date: 2018-02-06
- Inventor: Bernhard Winkler , Rainer Leuschner , Horst Theuss
- Applicant: INFINEON TECHNOLOGIES AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Schiff Hardin LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; G01L9/00 ; G01L15/00 ; G01L19/14

Abstract:
Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.
Public/Granted literature
- US20140103463A1 MEMS SENSOR PACKAGE SYSTEMS AND METHODS Public/Granted day:2014-04-17
Information query
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