According to embodiments of the disclosure, a thermal needle probe is provided. The thermal needle probe may include a heater, a cooler, a temperature measuring element, a heat conduction element and a processor. The heater is configured to heat an object. The cooler is configured to cool the object. The temperature measuring element is configured to measure a temperature raising curve of the object and a temperature dropping curve of the object. The heat conduction element is configured to conduct heat between the heater and the object. The processor is configured to determine a thermal property of the object according to at least one of the temperature raising curve and the temperature dropping curve.