Invention Grant
- Patent Title: Method of manufacturing mold, and molded article having fine relief structure on surface and method of manufacturing the same
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Application No.: US14419293Application Date: 2013-08-06
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Publication No.: US09908265B2Publication Date: 2018-03-06
- Inventor: Masashi Ikawa , Eiko Okamoto , Hiroshi Onomoto , Jitsuo Hirohata , Yuji Matsubara , Hideki Masuda
- Applicant: MITSUBISHI RAYON CO., LTD. , KANAGAWA ACADEMY OF SCIENCE AND TECHNOLOGY
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: MITSUBISHI CHEMICAL CORPORATION,KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: MITSUBISHI CHEMICAL CORPORATION,KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: JP2012-174349 20120806; JP2012-174350 20120806
- International Application: PCT/JP2013/071223 WO 20130806
- International Announcement: WO2014/024868 WO 20140213
- Main IPC: C25D11/04
- IPC: C25D11/04 ; C25D11/10 ; C25D5/18 ; C25D21/12 ; B29C33/38 ; C25D1/10 ; C25D5/48 ; C25D7/00 ; C25D9/06 ; C25D11/02 ; C25D11/12 ; C25D11/24
Abstract:
The present invention relates to a method of manufacturing a mold having an oxide film with a plurality of pores formed on a surface of an aluminum substrate, the method including (a) a process of applying a voltage to a machined aluminum substrate and anodizing a surface of the aluminum substrate to form an oxide film; and (b) a process of removing at least a part of the oxide film formed in the process (a), wherein a voltage (Va[V]) immediately before the process (a) is terminated and a time (ta[sec]) required to reach the voltage (Va[V]) after starting the application of voltage satisfy the following Equation (i) in the process (a). 0.010
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