Invention Grant
- Patent Title: Bridging electronic inter-connector and corresponding connection method
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Application No.: US15146364Application Date: 2016-05-04
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Publication No.: US09913376B2Publication Date: 2018-03-06
- Inventor: Anthony L. Long , Alexander Parra, II
- Applicant: Northrop Grumman Systems Corporation
- Applicant Address: US VA Falls Church
- Assignee: Northrop Grumman Systems Corporation
- Current Assignee: Northrop Grumman Systems Corporation
- Current Assignee Address: US VA Falls Church
- Agency: Patti & Malvone Law Group, LLC
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K1/14 ; H05K1/02 ; H05K1/18 ; H05K1/11

Abstract:
An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.
Public/Granted literature
- US20170325332A1 BRIDGING ELECTRONIC INTER-CONNECTOR AND CORRESPONDING CONNECTION METHOD Public/Granted day:2017-11-09
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