Invention Grant
- Patent Title: Method of forming a semiconductor package with conductive interconnect frame and structure
-
Application No.: US15134330Application Date: 2016-04-20
-
Publication No.: US09917039B2Publication Date: 2018-03-13
- Inventor: Marc Alan Mangrum , Thinh Van Pham
- Applicant: Amkor Technology Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agent Kevin B. Jackson
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01L21/48 ; H01L27/092
Abstract:
A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame having leadfingers configured for directly attaching to a semiconductor device, such as an integrated power semiconductor device that includes both power devices and logic type devices. The leadfingers are further configured to provide high current capacity and a high thermal dissipation capacity for the power device portion of the semiconductor device. In one embodiment, the conductive frame structure further includes a second frame joined to the first frame. The second frame includes a plurality of leads configured to electrically connect to low power device portions of the semiconductor device. A package body is formed to encapsulate the semiconductor device and at least portions of the leadfingers and leads.
Public/Granted literature
- US20170309554A1 METHOD OF FORMING A SEMICONDUCTOR PACKAGE WITH CONDUCTIVE INTERCONNECT FRAME AND STRUCTURE Public/Granted day:2017-10-26
Information query
IPC分类:
