Invention Grant
- Patent Title: Electronic device including a metal substrate and a semiconductor module embedded in a laminate
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Application No.: US15097453Application Date: 2016-04-13
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Publication No.: US09935027B2Publication Date: 2018-04-03
- Inventor: Markus Dinkel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102015107109 20150507
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/14 ; H01L23/538 ; H01L23/00
Abstract:
An electronic device having a substrate including a metal layer, an electrically insulating layer disposed above the substrate, a semiconductor module disposed above the electrically insulating layer and a lamination layer disposed above the electrically insulating layer. The lamination layer at least partially embeds the semiconductor module.
Public/Granted literature
- US20160329260A1 ELECTRONIC DEVICE INCLUDING A METAL SUBSTRATE AND A SEMICONDUCTOR MODULE EMBEDDED IN A LAMINATE Public/Granted day:2016-11-10
Information query
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