Invention Grant
- Patent Title: Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
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Application No.: US14885202Application Date: 2015-10-16
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Publication No.: US09935031B2Publication Date: 2018-04-03
- Inventor: Dirk Robert Walter Leipold , Julio C. Costa , Baker Scott , George Maxim
- Applicant: RF Micro Devices, Inc.
- Applicant Address: US NC Greensboro
- Assignee: Qorvo US, Inc.
- Current Assignee: Qorvo US, Inc.
- Current Assignee Address: US NC Greensboro
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/31 ; H01L21/304 ; H01L21/02 ; H01L21/683 ; H01L23/373 ; H01L23/00 ; H05K1/02 ; H05K1/18 ; H01Q1/50 ; H01L23/36 ; H01L21/56 ; H01L23/20 ; H01L23/367 ; H01L21/306 ; H01L23/522 ; H01L49/02
Abstract:
A printed circuit module having a protective layer in place of a low-resistivity handle layer and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and at least one deep well within the at least one device layer. A protective layer is disposed over the at least one deep well, wherein the protective layer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 106 Ohm-cm.
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