A wafer structure and a method for fabricating the wafer structure, and a spray apparatus are provided. An exemplary method for forming the wafer structure includes providing a wafer having a central region and a peripheral region surrounding the central region; forming an interlayer dielectric layer on a surface of the wafer in the central region not in the peripheral region; forming a buffer layer on the surface of the wafer in the peripheral region not in the central region; and forming a glue layer on the interlayer dielectric layer and the buffer layer. The buffer layer is used to reduce the lattice mismatch between the wafer and the glue layer; and reduce the stress between the wafer and the glue layer.