Invention Grant
- Patent Title: Substrate treating method
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Application No.: US14721346Application Date: 2015-05-26
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Publication No.: US09937520B2Publication Date: 2018-04-10
- Inventor: Masashi Kanaoka , Takehiro Wajiki , Shinichi Takada
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2014-115693 20140604
- Main IPC: B05D1/00
- IPC: B05D1/00 ; H01L21/67

Abstract:
A nozzle starts discharging a processing liquid while a spin chuck holds and rotates a substrate having a water-repellent film being formed on a surface thereof. The processing liquid is discharged to a position spaced away from the center of the substrate by a preset distance, and flows so as to converge into one stream on the substrate immediately after discharge of the processing liquid starts. This achieves suppression of the minute water droplets. Moreover, the nozzle is moved toward outside of the substrate while discharging the processing liquid successively. This allows entire flow of the processing liquid to move toward outside of the substrate while the processing liquid converging into one stream on the substrate is maintained. Here, inside the flow of the processing liquid is a dried region.
Public/Granted literature
- US20150352591A1 SUBSTRATE TREATING METHOD Public/Granted day:2015-12-10
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