An electronic device sealing arrangement includes a housing, an access door, a sealing member sized and configured to be sealingly compressed between the access door and the housing, a latch in operable communication with the housing and the access door, the latch being configured to compress the sealing member between the access door and the housing when moved to a position that latches the access door in a closed position, and a resilient member in operable communication with the latch and at least one of the housing and the access door, the resilient member being configured to at least partially compress when the access door is latched in the closed position and the sealing member is compressed between the access door and the housing.