公开(公告)号：US20160261812A1

公开(公告)日：2016-09-08

申请号：US14638808

申请日：2015-03-04

Applicant: Sensors Unlimited, Inc.

Inventor： John T. Foster ,  John Tagle ,  Dmitry Zhilinsky ,  Michael A. Liland ,  Laszlo Kovacs ,  Leonardo C. Gonzales

IPC: H04N5/378 ,  H01L23/00 ,  H04N5/33 ,  G06T5/40 ,  H04N5/32 ,  H01L27/146 ,  H01L23/29

CPC classification number: H04N5/378 ,  G06T5/40 ,  G06T2207/10116 ,  H01L23/291 ,  H01L23/295 ,  H01L23/556 ,  H01L23/57 ,  H01L23/573 ,  H01L27/14618 ,  H01L27/1465 ,  H04N5/32 ,  H04N5/33

Abstract: A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

Abstract translation: 本文公开了一种防止电子逆向工程的多层次方法。 可以基于对X射线检查基本上不透明来选择与光学传感器一起使用的密封剂。 以这种方式，可以减少获得竞争情报的明显的公众检查，并且电子设备的操作可能不受影响。 此外，恰好在密封剂表面下方嵌入的细丝细丝可以用作电子绊线，以响应于被逆向工程的强溶剂和酸分解和/或溶解。

公开(公告)号：US20180224719A1

公开(公告)日：2018-08-09

申请号：US15428251

申请日：2017-02-09

Applicant: Sensors Unlimited, Inc.

Inventor： Dmitry Zhilinsky

IPC: G03B17/14 ,  G02B7/14 ,  G02B27/00 ,  H04N5/225

CPC classification number: G03B17/14 ,  G02B7/14 ,  H04N5/2252 ,  H04N5/2254

Abstract: A bayonet mounting system includes an interchangeable component. The system also includes a housing having a cylindrical opening with a sealing surface on a radially inward facing surface and a frustoconical surface that tappers radially outwardly from the radially inward facing surface at the cylindrical opening. The frustoconical surface is configured to radially compress at least a portion of a resilient member during attachment of the interchangeable component to the housing. The housing also has a groove extending radially outward of at least a portion of the frustoconical surface configured to retain the interchangeable component to the housing in a bayonet latching fashion.

公开(公告)号：US20180077364A1

公开(公告)日：2018-03-15

申请号：US15266837

申请日：2016-09-15

Applicant: Sensors Unlimited, Inc.

Inventor： Henry W. Neal ,  Joshua Lund ,  Marc Hansen ,  Timothy Beystrum ,  Dmitry Zhilinsky ,  Michael D. Daugherty ,  Bert Blumenthal ,  Jonathan Nazemi ,  Andrew Eckhardt

IPC: H04N5/33 ,  H04N5/353 ,  G01J5/10 ,  F41G3/14 ,  F41G3/16

CPC classification number: H04N5/332 ,  F41G3/145 ,  F41G3/16 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/106 ,  G01S5/16 ,  G01S7/4804 ,  H04N5/3535

Abstract: An imaging method includes receiving electromagnetic radiation at a focal plane array of a handheld device. The electromagnetic radiation is processed within the handheld device, and visible images are displayed on the handheld device. The displayed visible images are indicative of a scene, and include a designator and a designator identifier when a high frequency laser pulse is in the scene. The designator and designator identifier represent the high frequency pulsed electromagnetic radiation received by the focal plane array when a high frequency pulse is present in the scene.

公开(公告)号：US20180073276A1

公开(公告)日：2018-03-15

申请号：US15261144

申请日：2016-09-09

Applicant: Sensors Unlimited, Inc.

Inventor： Dmitry Zhilinsky ,  Leonardo C. Gonzales

IPC: E05B65/00 ,  F16J15/02 ,  E05B65/06 ,  E05C3/12 ,  E05B15/00 ,  E06B7/16 ,  H04N5/225

CPC classification number: E05B65/001 ,  E05B15/0053 ,  E05B17/0025 ,  E05B39/007 ,  E05C3/047 ,  F16J15/021 ,  G03B17/08 ,  H04N5/2252

Abstract: An electronic device sealing arrangement includes a housing, an access door, a sealing member sized and configured to be sealingly compressed between the access door and the housing, a latch in operable communication with the housing and the access door, the latch being configured to compress the sealing member between the access door and the housing when moved to a position that latches the access door in a closed position, and a resilient member in operable communication with the latch and at least one of the housing and the access door, the resilient member being configured to at least partially compress when the access door is latched in the closed position and the sealing member is compressed between the access door and the housing.

公开(公告)号：US10218921B2

公开(公告)日：2019-02-26

申请号：US15266837

申请日：2016-09-15

Applicant: Sensors Unlimited, Inc.

Inventor： Henry W. Neal ,  Joshua Lund ,  Marc Hansen ,  Timothy Beystrum ,  Dmitry Zhilinsky ,  Michael D. Daugherty ,  Bert Blumenthal ,  Jonathan Nazemi ,  Andrew Eckhardt

IPC: H04N7/18 ,  H04N5/33 ,  F41G3/14 ,  F41G3/16 ,  G01J5/10 ,  H04N5/353 ,  G01S5/16 ,  G01S7/48 ,  G01J5/00

Abstract: An imaging method includes receiving electromagnetic radiation at a focal plane array of a handheld device. The electromagnetic radiation is processed within the handheld device, and visible images are displayed on the handheld device. The displayed visible images are indicative of a scene, and include a designator and a designator identifier when a high frequency laser pulse is in the scene. The designator and designator identifier represent the high frequency pulsed electromagnetic radiation received by the focal plane array when a high frequency pulse is present in the scene.

公开(公告)号：US10139706B2

公开(公告)日：2018-11-27

申请号：US15428251

申请日：2017-02-09

Applicant: Sensors Unlimited, Inc.

Inventor： Dmitry Zhilinsky

IPC: G03B17/14 ,  G02B7/14 ,  G02B27/00 ,  H04N5/225

Abstract: A bayonet mounting system includes an interchangeable component. The system also includes a housing having a cylindrical opening with a sealing surface on a radially inward facing surface and a frustoconical surface that tappers radially outwardly from the radially inward facing surface at the cylindrical opening. The frustoconical surface is configured to radially compress at least a portion of a resilient member during attachment of the interchangeable component to the housing. The housing also has a groove extending radially outward of at least a portion of the frustoconical surface configured to retain the interchangeable component to the housing in a bayonet latching fashion.

公开(公告)号：US09938752B2

公开(公告)日：2018-04-10

申请号：US15261144

申请日：2016-09-09

Applicant: Sensors Unlimited, Inc.

Inventor： Dmitry Zhilinsky ,  Leonardo C. Gonzales

IPC: H04N5/225 ,  E05B65/00 ,  F16J15/02 ,  E05B65/06 ,  E05C3/12 ,  E05B15/00 ,  E06B7/16

CPC classification number: E05B65/001 ,  E05B15/0053 ,  E05B17/0025 ,  E05B39/007 ,  E05C3/047 ,  F16J15/021 ,  G03B17/08 ,  H04N5/2252

Abstract: An electronic device sealing arrangement includes a housing, an access door, a sealing member sized and configured to be sealingly compressed between the access door and the housing, a latch in operable communication with the housing and the access door, the latch being configured to compress the sealing member between the access door and the housing when moved to a position that latches the access door in a closed position, and a resilient member in operable communication with the latch and at least one of the housing and the access door, the resilient member being configured to at least partially compress when the access door is latched in the closed position and the sealing member is compressed between the access door and the housing.

公开(公告)号：US09756273B2

公开(公告)日：2017-09-05

申请号：US14638808

申请日：2015-03-04

Applicant: Sensors Unlimited, Inc.

Inventor： John T. Foster ,  John Tagle ,  Dmitry Zhilinsky ,  Michael A. Liland ,  Laszlo Kovacs ,  Leonardo C. Gonzales

IPC: H04N5/378 ,  H01L23/29 ,  H01L23/556 ,  H01L23/00 ,  H01L27/146 ,  G06T5/40 ,  H04N5/32 ,  H04N5/33

CPC classification number: H04N5/378 ,  G06T5/40 ,  G06T2207/10116 ,  H01L23/291 ,  H01L23/295 ,  H01L23/556 ,  H01L23/57 ,  H01L23/573 ,  H01L27/14618 ,  H01L27/1465 ,  H04N5/32 ,  H04N5/33

Abstract: A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

公开(公告)号：US20160269715A1

公开(公告)日：2016-09-15

申请号：US14657641

申请日：2015-03-13

Applicant: Sensors Unlimited, Inc.

Inventor： Michael J. Evans ,  Marc Hansen ,  Joshua Lund ,  Dmitry Zhilinsky ,  Michael Delamere

IPC: H04N13/02 ,  G02B27/22

Abstract: A device for capturing an image includes a first camera having a first lens optically coupled to a first image sensor of a first format. A second camera having a second lens is optically coupled to a second image sensor of a second format larger than the first format. A controller is operatively connected to the first and second cameras for selecting a sub-array of an optical image of the second image sensor to match an optical image captured by the first image sensor based on needed parallax correction between the first and second cameras.

Abstract translation: 用于捕获图像的设备包括具有光学耦合到第一格式的第一图像传感器的第一透镜的第一相机。 具有第二透镜的第二相机光学耦合到比第一格式大的第二格式的第二图像传感器。 控制器可操作地连接到第一和第二相机，用于基于第一和第二相机之间的所需视差校正来选择第二图像传感器的光学图像的子阵列以匹配由第一图像传感器捕获的光学图像。

公开(公告)号：US20140312450A1

公开(公告)日：2014-10-23

申请号：US14198923

申请日：2014-03-06

Applicant: Sensors Unlimited, Inc.

Inventor： John Tagle ,  Dmitry Zhilinsky ,  Michael Liland, JR.

IPC: H01L27/146

CPC classification number: H01L27/1469 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method and structure of an image sensor device including a read out integrated circuit (ROIC) and a photodiode array (PDA). An embodiment may include a package substrate having a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB.

Abstract translation: 包括读出集成电路（ROIC）和光电二极管阵列（PDA）的图像传感器装置的方法和结构。 实施例可以包括在凹部内具有凹部和凸起的基座的封装基板; 读出的集成电路（ROIC）物理地连接到凸起的基座上; 物理地连接到ROIC并与其电耦合的光电二极管阵列（PDA）; 以及印刷电路板（PCB），其位于所述封装衬底的所述凹部内，其中所述PCB在其中具有开口，并且所述升高的基座至少部分延伸穿过所述PCB中的所述开口。