Invention Grant
- Patent Title: Suspension board with circuit and producing method thereof
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Application No.: US15368855Application Date: 2016-12-05
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Publication No.: US09942983B2Publication Date: 2018-04-10
- Inventor: Yoshito Fujimura
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2015-238852 20151207
- Main IPC: G11B5/48
- IPC: G11B5/48 ; H05K1/05 ; H05K1/11 ; H05K1/18 ; H05K3/00

Abstract:
A suspension board with circuit includes a metal supporting board, a conductor layer, a first insulating layer disposed between the metal supporting board and the conductor layer and having a first thickness, a second insulating layer having a second thickness in a portion disposed on the first insulating layer, and a pedestal disposed on the metal supporting board. The pedestal includes a first layer prepared from the same material as that of the first insulating layer and a second layer prepared from the same material as that of the second insulating layer. The thickness of the pedestal is different from any one of the first thickness, the second thickness, and the total sum of the first thickness and the second thickness.
Public/Granted literature
- US20170164477A1 SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF Public/Granted day:2017-06-08
Information query
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