Invention Grant
- Patent Title: Assessing alignment of top and bottom ends of TSVs and characterizing microfabrication process
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Application No.: US14762613Application Date: 2014-01-23
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Publication No.: US09952041B2Publication Date: 2018-04-24
- Inventor: Rajiv Roy , David Grant , David S. Marx , Hanh Chu
- Applicant: Rudolph Technologies, Inc.
- Applicant Address: US MA Wilmington
- Assignee: Rudolph Technologies, Inc.
- Current Assignee: Rudolph Technologies, Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Dicke, Billig & Czaja, PLLC
- International Application: PCT/US2014/012827 WO 20140123
- International Announcement: WO2014/116878 WO 20140731
- Main IPC: G01B11/02
- IPC: G01B11/02 ; G01B11/27 ; G01B9/02 ; H01L21/66 ; G01N21/956
Abstract:
A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.
Public/Granted literature
- US20150362314A1 METHOD OF CHARACTERIZING MICROFABRICATION PROCESS AND PRODUCTS THEREOF Public/Granted day:2015-12-17
Information query
