公开(公告)号：US20150362314A1

公开(公告)日：2015-12-17

申请号：US14762613

申请日：2014-01-23

Applicant: RUDOLPH TECHNOLOGIES, INC.

Inventor： Rajiv Roy ,  David Grant ,  David S. Marx ,  Hanh Chu

IPC: G01B11/27

CPC classification number: G01B11/272 ,  G01B9/02044 ,  G01B9/0209 ,  G01N21/95692 ,  H01L22/12 ,  H01L2224/16 ,  H01L2924/15311

Abstract: A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.

Abstract translation: 描述微加工过程表征的方法及其产物。 通过确定TSV的顶端和底端的几何形状和位置来评估其中形成有TSV的衬底。 可以评估个体TSV以及在底物中形成的TSV的整个图案。

公开(公告)号：US09952041B2

公开(公告)日：2018-04-24

申请号：US14762613

申请日：2014-01-23

Applicant: Rudolph Technologies, Inc.

Inventor： Rajiv Roy ,  David Grant ,  David S. Marx ,  Hanh Chu

IPC: G01B11/02 ,  G01B11/27 ,  G01B9/02 ,  H01L21/66 ,  G01N21/956

CPC classification number: G01B11/272 ,  G01B9/02044 ,  G01B9/0209 ,  G01N21/95692 ,  H01L22/12 ,  H01L2224/16 ,  H01L2924/15311

Abstract: A method for characterizing a microfabrication process and the product thereof is described. A substrate having TSV's formed therein is assessed by determining the geometries and positions of the top and bottom ends of a TSV. Individual TSV's as well as the entire pattern of TSV's formed in a substrate may be assessed.