- Patent Title: Heat dissipating module, heat dissipating system and circuit module
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Application No.: US15093175Application Date: 2016-04-07
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Publication No.: US09953896B2Publication Date: 2018-04-24
- Inventor: Chang-han Tsai , Shui-Fa Tsai
- Applicant: COOLER MASTER TECHNOLOGY INC.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER TECHNOLOGY INC.
- Current Assignee: COOLER MASTER TECHNOLOGY INC.
- Current Assignee Address: TW New Taipei
- Agent Winston Hsu
- Priority: CN201520788842U 20151012
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H01L23/473

Abstract:
The present application provides a heat dissipating module, a heat dissipating system and a circuit module. The heat dissipating module adapted to be used with a heat element. The heat dissipating module comprises a heat exchanger which has a heat exchanging zone contacted with the heat element; a securing structure; and a fluid driving unit which is communicated with the heat exchanger for guiding a working fluid into the heat exchanger and is secured to the heat exchanger by the securing structure, wherein the fluid driving unit and the second heat exchanger are separately installed and communicated with each other.
Public/Granted literature
- US20170105312A1 HEAT DISSIPATING MODULE, HEAT DISSIPATING SYSTEM AND CIRCUIT MODULE Public/Granted day:2017-04-13
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