公开(公告)号：US09953896B2

公开(公告)日：2018-04-24

申请号：US15093175

申请日：2016-04-07

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Chang-han Tsai ,  Shui-Fa Tsai

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/473

CPC classification number: H01L23/473 ,  G06F1/20 ,  H05K7/20218 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20409

Abstract: The present application provides a heat dissipating module, a heat dissipating system and a circuit module. The heat dissipating module adapted to be used with a heat element. The heat dissipating module comprises a heat exchanger which has a heat exchanging zone contacted with the heat element; a securing structure; and a fluid driving unit which is communicated with the heat exchanger for guiding a working fluid into the heat exchanger and is secured to the heat exchanger by the securing structure, wherein the fluid driving unit and the second heat exchanger are separately installed and communicated with each other.