Invention Grant
- Patent Title: Printed circuit boards by massive parallel assembly
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Application No.: US13571252Application Date: 2012-08-09
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Publication No.: US09961771B2Publication Date: 2018-05-01
- Inventor: JengPing Lu , Eugene M. Chow
- Applicant: JengPing Lu , Eugene M. Chow
- Applicant Address: US CA Palo Alto
- Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
- Current Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
- Current Assignee Address: US CA Palo Alto
- Agency: Marger Johnson
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; H05K3/36
Abstract:
A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.
Public/Granted literature
- US20120297618A1 PRINTED CIRCUIT BOARDS BY MASSIVE PARALLEL ASSEMBLY Public/Granted day:2012-11-29
Information query
