Invention Grant
- Patent Title: Patterning of graphene circuits on flexible substrates
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Application No.: US15090703Application Date: 2016-04-05
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Publication No.: US09974188B2Publication Date: 2018-05-15
- Inventor: Kelvin Po Leung Pun , Chee Wah Cheung
- Applicant: Compass Technology Company Limited
- Applicant Address: HK Shatin
- Assignee: Compass Technology Company Limited
- Current Assignee: Compass Technology Company Limited
- Current Assignee Address: HK Shatin
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman; Rosemary L. S. Pike
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K3/00 ; H05K1/02 ; H05K1/03

Abstract:
A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween.
Public/Granted literature
- US20170290167A1 Patterning of Graphene Circuits on Flexible Substrates Public/Granted day:2017-10-05
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