Invention Grant
- Patent Title: Pattern-measuring apparatus and semiconductor-measuring system
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Application No.: US14768600Application Date: 2014-02-05
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Publication No.: US09990708B2Publication Date: 2018-06-05
- Inventor: Yasutaka Toyoda , Norio Hasegawa , Takeshi Kato , Hitoshi Sugahara , Yutaka Hojo , Daisuke Hibino , Hiroyuki Shindo
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2013-030547 20130220
- International Application: PCT/JP2014/052611 WO 20140205
- International Announcement: WO2014/129307 WO 20140828
- Main IPC: G06T7/00
- IPC: G06T7/00 ; H01J37/28 ; H01J37/22 ; G01N23/225 ; H01L21/66

Abstract:
An object of the present invention is to provide a pattern-measuring apparatus and a semiconductor-measuring system which are able to obtain an evaluation result for suitably selecting processing with respect to a semiconductor device. In the present invention for attaining the object described above, there is proposed a pattern-measuring apparatus including an arithmetic device which compares a circuit pattern of an electronic device with a reference pattern, in which the arithmetic device classifies the circuit pattern in processing unit of the circuit pattern on the basis of a comparison of a measurement result between the circuit pattern and the reference pattern with at least two threshold values.
Public/Granted literature
- US20160005157A1 Pattern-Measuring Apparatus and Semiconductor-Measuring System Public/Granted day:2016-01-07
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