Invention Grant
- Patent Title: Semiconductor device and related manufacturing method
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Application No.: US15631113Application Date: 2017-06-23
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Publication No.: US09991082B2Publication Date: 2018-06-05
- Inventor: Deyuan Xiao
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN
- Agency: Innovation Counsel LLP
- Priority: CN201410129139 20140401
- Main IPC: H01J21/06
- IPC: H01J21/06 ; H01J19/28 ; H01J19/38 ; H01J9/24 ; H01J9/14 ; H01J9/385

Abstract:
A semiconductor device may include the following elements: a semiconductor substrate, an insulator positioned on the substrate, a source electrode positioned on the insulator, a drain electrode positioned on the insulator, a gate electrode positioned between the source electrode and the drain electrode, a hollow channel surrounded by the gate electrode and positioned between the source electrode and the drain electrode, a dielectric member positioned between the hollow channel and the gate electrode, a first insulating member positioned between the gate electrode and the source electrode, and a second insulating member positioned between the gate electrode and the drain electrode.
Public/Granted literature
- US20170294284A1 SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD Public/Granted day:2017-10-12
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