Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3), and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that, during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).