公开(公告)号：WO2011036150A1

公开(公告)日：2011-03-31

申请号：PCT/EP2010/063898

申请日：2010-09-21

Applicant: ATS AUTOMATION TECHNOLOGY SERVICES ,  HYNES, Fergus ,  FINLAY, Garreth

Inventor： HYNES, Fergus ,  FINLAY, Garreth

IPC: G06K19/077 ,  H05K1/18

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H05K1/184 ,  H05K3/103 ,  H05K3/328 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10287 ,  H05K2201/10727

Abstract: Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3), and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that, during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).

Abstract translation: 用于将至少一个线导体（6）与芯片模块（5）的至少一个终端装置（22a，22b）连接起来用于产生包括线圈装置（2）和所述芯片模块（5）的应答器装置（1）的方法 ），其中，在第一方法步骤中，线圈装置（2）被布置并固定在基板（3）上，并且在另一方法步骤中，线圈装置（2）的导线（6）被连接 所述芯片模块（5）的特征在于，在所述第一方法步骤期间，所述导线（6）的端部（7a，7b）被放置成以间隔开的方式延伸穿过所述容纳窗（4） 在用于芯片模块（5）的容纳窗（4）的中心区域（Z）中，延伸穿过容纳窗（4）的导线（6）的部分区域（8a，8b）从所述 中心区域（Z）通过定位装置（3）朝向容纳窗（4）的对应边缘（23a，23b）延伸，直到部分区域（8a，8b）的至少一部分延伸 在端子区域（22a，22b）的期望位置之后，芯片模块（5）随后插入容纳窗口（4）中，然后将该部分与端子区域（22a，22b）以导电方式连接， 。

公开(公告)号：EP2302566A1

公开(公告)日：2011-03-30

申请号：EP09012053.6

申请日：2009-09-22

Applicant: ats Automation Technology Services

Inventor： Fergus Hynes ,  Garreth Finlay

IPC: G06K19/077 ,  H05K1/18

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H05K1/184 ,  H05K3/103 ,  H05K3/328 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10287 ,  H05K2201/10727

Abstract: Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3),and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that , during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).

Abstract translation: 用于连接至少一个线导体的方法（6）与至少一个终端设备（22A，22B）的芯片模块（5），用于生产（1），包括线圈装置的应答器设备（2）和所述芯片模块（5 ）worin，在第一方法步骤中，将线圈装置（2）设置并固定在一个基片（3），并且在进一步的方法步骤中，导线导体（6），线圈装置（2）连接 到芯片模块（5），在第一方法步骤中该特征的，端部（7A，7B）的金属丝导体（6）布置成以间隔开的穿过容纳窗口（4）延伸的 在容纳窗口的中心区域（Z）的关系（4）芯片模块（5），该部分区域（8A，8B）的金属丝导体（6）在整个容纳窗口延伸的（4）从所述移位 中央区域（Z）朝向相应的边缘（23A，23B）通过定位装置的手段的容纳窗口（4）的（3），直到至少部分区域的部分（8A，8B）延伸 在终端区域的所希望的位置（22A，22B），所述芯片模块（5）随后插入到容纳窗（4）和部分随后与终端区域连接在导电的方式（22A，22B） ，

公开(公告)号：EP2302566B1

公开(公告)日：2013-03-27

申请号：EP09012053.6

申请日：2009-09-22

Applicant: ats Automation Technology Services

Inventor： Hynes, Fergus ,  Finlay, Garreth

IPC: G06K19/077 ,  H05K1/18

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H05K1/184 ,  H05K3/103 ,  H05K3/328 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10287 ,  H05K2201/10727