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公开(公告)号：US06818155B2
公开(公告)日：2004-11-16
申请号：US10039300
申请日：2002-01-02
Applicant: George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
Inventor： George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
IPC: H01L2943
CPC classification number: H05K3/321 , H05K2201/0248 , H05K2201/083 , H05K2201/10636 , H05K2203/104 , Y02P70/611 , Y10T428/2852 , Y10T428/2896 , Y10T428/32
Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
Abstract translation: 使用聚合物和磁性材料颗粒的组合物将组分偶联到下面的衬底上。 当在组件和印刷电路板之间施加组合物时，可以对组合物进行磁场以将磁性材料颗粒对准到组件和下层衬底之间的导电路径中。 同时，聚合物基材料可以固化或固化，以固定由磁性材料颗粒形成的导电路径。
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公开(公告)号：US06875367B2
公开(公告)日：2005-04-05
申请号：US10696075
申请日：2003-10-28
Applicant: George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
Inventor： George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
CPC classification number: H05K3/321 , H05K2201/0248 , H05K2201/083 , H05K2201/10636 , H05K2203/104 , Y02P70/611 , Y10T428/2852 , Y10T428/2896 , Y10T428/32
Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
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公开(公告)号：US06878305B2
公开(公告)日：2005-04-12
申请号：US10696521
申请日：2003-10-28
Applicant: George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
Inventor： George Hsieh , Terrance J. Dishongh , Norman J. Armendariz , David V. Spaulding
CPC classification number: H05K3/321 , H05K2201/0248 , H05K2201/083 , H05K2201/10636 , H05K2203/104 , Y02P70/611 , Y10T428/2852 , Y10T428/2896 , Y10T428/32
Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.
Abstract translation: 使用聚合物和磁性材料颗粒的组合物将组分偶联到下面的衬底上。 当在组件和印刷电路板之间施加组合物时，可以对组合物进行磁场以将磁性材料颗粒对准到组件和下层衬底之间的导电路径中。 同时，聚合物基材料可以固化或固化，以固定由磁性材料颗粒形成的导电路径。
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