公开(公告)号：US20180339425A1

公开(公告)日：2018-11-29

申请号：US15771524

申请日：2016-10-27

Applicant: SYNBRA TECHNOLOGY B.V. ,  SAVIOLA HOLDING S.R.L.

Inventor： Jan NOORDEGRAAF ,  Kenneth van den HOONAARD ,  Josephus Petrus Maria de JONG ,  Nicola NEGRI ,  Alberto BOTTOLI ,  Peter MATTHIJSSEN

IPC: B27N3/02 ,  B27N3/00 ,  B27N3/06 ,  B32B21/08

Abstract: The present invention relates to a process for preparing a wood chip board comprising drying a cut raw material, classifying the dried material into several portions, gluing at least one of said portions with a resin and compressing the chip material under pressure and heat to form a board. The present invention also relates to a wood chip board and its use.

公开(公告)号：WO2017072220A1

公开(公告)日：2017-05-04

申请号：PCT/EP2016/075906

申请日：2016-10-27

Applicant: SYNBRA TECHNOLOGY B.V. ,  SAVIOLA HOLDING S.R.L.

Inventor： NOORDEGRAAF, Jan ,  VAN DEN HOONAARD, Kenneth ,  DE JONG, Josephus Petrus Maria ,  NEGRI, Nicola ,  BOTTOLI, Alberto ,  MATTHIJSSEN, Peter

IPC: B27N3/02

CPC classification number: B27N3/02

Abstract: The present invention relates to a process for preparing a wood chip board comprising drying a cut raw material, classifying the dried material into several portions, gluing at least one of said portions with a resin and compressing the chip material under pressure and heat to form a board. The present invention also relates to a wood chip board and its use.

Abstract translation: 本发明涉及一种制造木屑板的方法，该方法包括干燥切割的原材料，将干燥的材料分成若干部分，用树脂胶合至少一个所述部分并压缩芯片 材料在压力和热量下形成一块板子。 本发明还涉及一种木屑板及其用途。

公开(公告)号：EP3368258A1

公开(公告)日：2018-09-05

申请号：EP16787863.6

申请日：2016-10-27

Applicant: Synbra Technology B.V. ,  Saviola Holding S.r.l.

Inventor： NOORDEGRAAF, Jan ,  VAN DEN HOONAARD, Kenneth ,  DE JONG, Josephus Petrus Maria ,  NEGRI, Nicola ,  BOTTOLI, Alberto ,  MATTHIJSSEN, Peter

IPC: B27N3/02

CPC classification number: B27N3/02 ,  B27N3/007 ,  B27N3/06 ,  B32B21/08

Abstract: The present invention relates to a process for preparing a wood chip board comprising drying a cut raw material, classifying the dried material into several portions, gluing at least one of said portions with a resin and compressing the chip material under pressure and heat to form a board. The present invention also relates to a wood chip board and its use.