公开(公告)号：US20180339425A1

公开(公告)日：2018-11-29

申请号：US15771524

申请日：2016-10-27

Applicant: SYNBRA TECHNOLOGY B.V. ,  SAVIOLA HOLDING S.R.L.

Inventor： Jan NOORDEGRAAF ,  Kenneth van den HOONAARD ,  Josephus Petrus Maria de JONG ,  Nicola NEGRI ,  Alberto BOTTOLI ,  Peter MATTHIJSSEN

IPC: B27N3/02 ,  B27N3/00 ,  B27N3/06 ,  B32B21/08

Abstract: The present invention relates to a process for preparing a wood chip board comprising drying a cut raw material, classifying the dried material into several portions, gluing at least one of said portions with a resin and compressing the chip material under pressure and heat to form a board. The present invention also relates to a wood chip board and its use.