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公开(公告)号：KR1020180086751A
公开(公告)日：2018-08-01
申请号：KR1020170010577
申请日：2017-01-23
Applicant: 국방과학연구소
Abstract: 본발명에따른펄스세기추정방법은, 전자전수신기에서의미상레이더신호의펄스세기추정에관한것으로서, 수신된신호의전력에서수신기의잡음에의한전력을제거하여잡음이제거된수신신호에의한전력을추정한후, 이를이용해펄스세기를추정하는것을특징으로한다.
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公开(公告)号：KR101712893B1
公开(公告)日：2017-03-07
申请号：KR1020160137664
申请日：2016-10-21
Applicant: 국방과학연구소
IPC: H04L25/02 , H04L27/233 , H04L27/26
CPC classification number: H04L25/0212 , H04L27/2334 , H04L27/261
Abstract: 본발명에따른입력신호의펄스정보를산출하는신호감지장치의제어방법에있어서, 입력신호의펄스정보를산출하는신호감지장치의제어방법에있어서, 입력신호를수신하는단계와제1필터길이를갖는차동이동평균필터에근거하여, 상기입력신호에대응되는제1출력신호를산출하는단계와상기제1필터길이와다른제2필터길이를갖는차동이동평균필터에근거하여, 상기입력신호에대응되는제2출력신호를산출하는단계및 상기제1출력신호및 제2출력신호에근거하여, 상기입력신호의펄스정보를추정하는단계를포함하고, 상기제1출력신호를산출하는단계는상기제1필터길이를갖는차동이동평균필터의출력초기값을설정하는단계와기 설정된제1수식에따라상기설정된출력초기값을이용하여, 제1필터길이를갖는차동이동평균필터의제1서브신호를산출하는단계및 상기제1수식과다른제2수식에따라상기제1서브신호를이용하여, 제2서브신호를산출하는단계를포함하고, 상기제2수식은제2서브신호의산출시, 계산량을감소하기위하여, 복수의시간인덱스중 이전에산출된시간인덱스의서브신호를이용하여그 다음에산출될시간인덱스의서브신호를계산하도록이루어진것을특징으로한다.
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公开(公告)号：KR1020140073786A
公开(公告)日：2014-06-17
申请号：KR1020120141639
申请日：2012-12-07
Applicant: 국방과학연구소
Abstract: The present invention relates to a microwave transmit/receive module and a packaging method for same. The microwave transmit/receive module comprises: a multi-layer board including a plurality of individual boards stacked through a single process with a circuit pattern formed on the each of the individual boards for high frequency transmission lines, power supply signals, control signals, and a ground surface, and a conductive through hole formed in an identical area among the center area of each of the individual boards for signal connection and ground surface formation between the plurality of individual boards; a housing having a monolithic microwave integrated circuit (MMIC) component mounted to a position corresponding to the conductive through hole of the multi-layer board and integrated at a bottom side of the multi-layer board to allow the mounted MMIC component to be connected to the multi-layer board; a cover integrated from a top side of the multi-layer board with respect to the conductive through hole so as to be connected to the MMIC component exposed to the top side of the multi-layer board through the conductive through hole and a signal pattern around the conductive through hole of a top portion of the multi-layer board. According to this, compared to co-fired ceramic stacking technology, manufacturing cost can be reduced by stacking the multi-layer board through a single process. In addition, the present invention can be variously applied to development of similar products capable of receiving multiple channels due to less restriction according to the size of the boards.
Abstract translation: 本发明涉及一种微波发射/接收模块及其包装方法。 微波发射/接收模块包括：多层板，其包括通过单个工艺堆叠的多个单独的板，其中形成在用于高频传输线的每个单独板上的电路图案，电源信号，控制信号和 地面和形成在每个单独板的中心区域中的相同区域中的导电通孔，用于信号连接和多个单独板之间的地表面形成; 壳体，其具有安装到与多层板的导电通孔相对应的位置并且整合在多层板的底侧的单片微波集成电路（MMIC）部件，以允许安装的MMIC部件连接到 多层板; 从多层板的上侧相对于导电性通孔形成的盖，通过导电性通孔与多层板的上侧暴露于MMIC部件，以及周围的信号图案连接 多层板的顶部的导电通孔。 据此，与共烧陶瓷堆叠技术相比，通过单一工艺堆叠多层板可以降低制造成本。 此外，本发明可以各种应用于由于根据板的尺寸而受到较少限制的能够接收多个通道的类似产品的开发。
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