公开(公告)号：KR1020140073786A

公开(公告)日：2014-06-17

申请号：KR1020120141639

申请日：2012-12-07

Applicant: 국방과학연구소

Inventor： 김두수 ,  김선주 ,  남병창 ,  김종필 ,  이유리

IPC: G01S7/03 ,  G01S13/88

Abstract: The present invention relates to a microwave transmit/receive module and a packaging method for same. The microwave transmit/receive module comprises: a multi-layer board including a plurality of individual boards stacked through a single process with a circuit pattern formed on the each of the individual boards for high frequency transmission lines, power supply signals, control signals, and a ground surface, and a conductive through hole formed in an identical area among the center area of each of the individual boards for signal connection and ground surface formation between the plurality of individual boards; a housing having a monolithic microwave integrated circuit (MMIC) component mounted to a position corresponding to the conductive through hole of the multi-layer board and integrated at a bottom side of the multi-layer board to allow the mounted MMIC component to be connected to the multi-layer board; a cover integrated from a top side of the multi-layer board with respect to the conductive through hole so as to be connected to the MMIC component exposed to the top side of the multi-layer board through the conductive through hole and a signal pattern around the conductive through hole of a top portion of the multi-layer board. According to this, compared to co-fired ceramic stacking technology, manufacturing cost can be reduced by stacking the multi-layer board through a single process. In addition, the present invention can be variously applied to development of similar products capable of receiving multiple channels due to less restriction according to the size of the boards.

Abstract translation: 本发明涉及一种微波发射/接收模块及其包装方法。 微波发射/接收模块包括：多层板，其包括通过单个工艺堆叠的多个单独的板，其中形成在用于高频传输线的每个单独板上的电路图案，电源信号，控制信号和 地面和形成在每个单独板的中心区域中的相同区域中的导电通孔，用于信号连接和多个单独板之间的地表面形成; 壳体，其具有安装到与多层板的导电通孔相对应的位置并且整合在多层板的底侧的单片微波集成电路（MMIC）部件，以允许安装的MMIC部件连接到 多层板; 从多层板的上侧相对于导电性通孔形成的盖，通过导电性通孔与多层板的上侧暴露于MMIC部件，以及周围的信号图案连接 多层板的顶部的导电通孔。 据此，与共烧陶瓷堆叠技术相比，通过单一工艺堆叠多层板可以降低制造成本。 此外，本发明可以各种应用于由于根据板的尺寸而受到较少限制的能够接收多个通道的类似产品的开发。