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公开(公告)号:KR100319462B1
公开(公告)日:2002-01-12
申请号:KR1019990018264
申请日:1999-05-20
Applicant: 대한민국(충남대학교)
IPC: H01L27/00
Abstract: 본발명은반도체기억소자구조와그 제조방법에관한것으로, 실리콘계열의기재의상측에트리테트라메틸헵타네디오나토이트륨(Tris(2,2,6,6-tetramethyl-3, 5-heptanedionato)Yttrium(Ⅲ))과메틸사이크로펜타디에닐망간트리카보닐((CHCH)Mn(CO))을각각열분해한후 화학반응기안에서산소와함께반응시켜이트륨망간네이트(YMnO)층을형성한후, 상기이트륨망간네이트(YMnO)층을절연층으로사용하여이 상측에스트론튬비스무스탄탈레이트(SrBiTaO)층을물리적인증착방법으로형성하여이루어지는반도체기억소자구조및 그제조방법에관한것이다. 이러한구성에의하면, 치밀한미세구조를갖는박막을얻을수있으며고온에서안정한계면상태를유지하여실리콘의산화도억제되고각층의구성원소들의상호확산도거의일어나지않아이러한구조는탁월한신뢰성을가진반도체기억소자로서활용될수 있는데, 특히비휘발성강유전체전계효과기억소자로서뛰어난기능을가진다.
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公开(公告)号:KR1020000074364A
公开(公告)日:2000-12-15
申请号:KR1019990018264
申请日:1999-05-20
Applicant: 대한민국(충남대학교)
IPC: H01L27/00
Abstract: PURPOSE: A semiconductor memory device structure is provided to be used in a non-volatile ferroelectric field effect transistor(FET) memory device, by maintaining a stable interface characteristic and a good diffusion blocking characteristic after a high temperature process. CONSTITUTION: A semiconductor memory device structure comprises a silicon-series material, an yttrium manganate (YMnO3) layer, a strontium bismuth tantalate(SrBi2Ta2O9) layer. The yttrium manganate layer is evaporated on the surface of the silicon-series material. The strontium bismuth tantalate layer is evaporated on the yttrium manganate layer. And the semiconductor memory device structure further comprises a platinum layer evaporated on the SrBi2Ta2O9 layer.
Abstract translation: 目的:通过在高温处理后保持稳定的界面特性和良好的扩散阻挡特性,提供了用于非挥发性铁电场效应晶体管(FET)存储器件的半导体存储器件结构。 构成:半导体存储器件结构包括硅系材料,锰酸钇(YMnO3)层,钽酸钡锶钡(SrBi2Ta2O9)层。 在硅系材料的表面上蒸发锰酸钇层。 钽酸锶钽酸盐层在锰酸钇层上蒸发。 并且半导体存储器件结构还包括在SrBi2Ta2O9层上蒸发的铂层。
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