마이크로 가스 센서 및 그 제조 방법
    1.
    发明公开
    마이크로 가스 센서 및 그 제조 방법 失效
    微气体传感器及其制造方法

    公开(公告)号:KR1020100097257A

    公开(公告)日:2010-09-03

    申请号:KR1020090016104

    申请日:2009-02-26

    Abstract: PURPOSE: A micro gas sensor and a manufacturing method thereof are intended to provide a micro heater not requiring a particular pattern through the prior etching of an upper silicon substrate. CONSTITUTION: A micro gas sensor comprises a substrate(200), a first insulation layer(201), a second insulation layer(202), a third insulation layer(203), a micro heater(204), a power electrode(205), a fourth insulation layer(206), a sensing electrode(208), and a sensing material(209). The first insulation layer and the second insulation layer are formed on the substrate. The third insulation layer is formed on an upper cavity which is formed through the etching of the first insulation layer and the substrate, and the upper part of the first insulation layer which is not etched. The micro heater is formed on a part of the third insulation layer. The power electrode is electrically connected to the micro heater and is formed on the third insulation layer. The fourth insulation layer covers the micro heater and the power electrode and exposes the upper part of the power electrode. The sensing electrode is formed on the fourth insulation layer. The sensing material is coated on the sensing electrode. A part of the upper part of the third insulation layer is etched and a lower cavity is formed on the rear side of the substrate and the second insulation layer.

    Abstract translation: 目的:微气体传感器及其制造方法旨在通过先前蚀刻上硅衬底来提供不需要特定图案的微加热器。 构造:微气体传感器包括衬底(200),第一绝缘层(201),第二绝缘层(202),第三绝缘层(203),微加热器(204),功率电极(205) ,第四绝缘层(206),感测电极(208)和感测材料(209)。 第一绝缘层和第二绝缘层形成在基板上。 第三绝缘层形成在通过第一绝缘层和基板的蚀刻形成的上腔体和未被蚀刻的第一绝缘层的上部。 微加热器形成在第三绝缘层的一部分上。 电力电极与微加热器电连接并形成在第三绝缘层上。 第四绝缘层覆盖微加热器和电源电极并暴露电源电极的上部。 感测电极形成在第四绝缘层上。 感测材料涂覆在感测电极上。 蚀刻第三绝缘层的上部的一部分,并且在基板的后侧和第二绝缘层上形成下腔。

    마이크로 가스 센서 및 그 제조 방법
    2.
    发明授权
    마이크로 가스 센서 및 그 제조 방법 失效
    微气体传感器及其制造方法

    公开(公告)号:KR101078187B1

    公开(公告)日:2011-11-10

    申请号:KR1020090016104

    申请日:2009-02-26

    Abstract: 본발명에따른마이크로가스센서는기판; 상기기판상에형성되는제 1 절연층및 제 2 절연층; 상기기판및 상기제1 절연층이식각되어상부캐비티가형성된후 상기상부캐비티및 식각되지않은제1 절연층의상부에형성되는제 3 절연층; 상기제3 절연층상의일부에형성되는마이크로히터; 상기마이크로히터와전기적으로연결되어상기제 3 절연층상의일부에형성되는전원전극; 상기마이크로히터및 상기전원전극을감싸고, 상기전원전극의상부가노출되도록형성되는제 4 절연층; 상기제 4 절연층상에형성되는감지전극; 및상기감지전극상에도포되는감지물질을포함하고, 상기기판의배면과상기제 2 절연층에는상기제 3 절연층의하부일부분이외부에노출되도록식각되어하부캐비티가형성되는것을구성적특징으로한다.

Patent Agency Ranking