公开(公告)号：US20250109240A1

公开(公告)日：2025-04-03

申请号：US18834870

申请日：2023-03-03

Applicant: ADEKA CORPORATION

Inventor： Takuya MIWA ,  Yui HASEGAWA ,  Ken-ichi TAMASO

IPC: C08G59/22 ,  C08G59/50 ,  C09J163/00

Abstract: An objective of the present invention is to provide an epoxy resin composition containing a reactive diluent capable of reducing viscosity while maintaining the epoxy resin's original properties as much as possible, and also capable of imparting novel additional effects such as adhesiveness, storage stability, etc. The invention relates to a one-pack type epoxy resin composition containing: component (A): a compound represented by general formula (1); component (B): an epoxy resin; and component (C): an amine-based curing agent. In the general formula (1), R1 represents a hydrogen atom or a methyl group; R2 and R3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms; and n represents an integer of 1 to 3.