CURABLE RESIN COMPOSITION
    1.
    发明公开

    公开(公告)号:US20240317967A1

    公开(公告)日:2024-09-26

    申请号:US18262521

    申请日:2022-01-25

    CPC classification number: C08K5/3415 C08G59/5073

    Abstract: A curing resin composition well balanced in curing properties and storage stability. The composition contains (A) an epoxy resin, (B) a curing agent, and (C) at least one of imide compounds represented by formulae (1-1), (1-2), and (1-3), wherein R11 represents an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.; R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, etc.; and R12 and R13 each independently represent a hydrogen atom, an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.

    ONE-PACK TYPE EPOXY RESIN COMPOSITION

    公开(公告)号:US20250109240A1

    公开(公告)日:2025-04-03

    申请号:US18834870

    申请日:2023-03-03

    Abstract: An objective of the present invention is to provide an epoxy resin composition containing a reactive diluent capable of reducing viscosity while maintaining the epoxy resin's original properties as much as possible, and also capable of imparting novel additional effects such as adhesiveness, storage stability, etc. The invention relates to a one-pack type epoxy resin composition containing: component (A): a compound represented by general formula (1); component (B): an epoxy resin; and component (C): an amine-based curing agent. In the general formula (1), R1 represents a hydrogen atom or a methyl group; R2 and R3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms; and n represents an integer of 1 to 3.

    CLATHRATE COMPOUND, EPOXY RESIN CURING AGENT, AND CURABLE RESIN COMPOSITION

    公开(公告)号:US20240409681A1

    公开(公告)日:2024-12-12

    申请号:US18698296

    申请日:2022-10-17

    Abstract: A clathrate compound obtained by mixing an imidazole compound (A) and a polyhydric phenol compound (B), wherein the clathrate compound has an average particle size (X) of 7 μm or less, and a maximum particle size (Y) of 40 μm or less. The imidazole compound (A) is preferably at least one selected from compounds represented by the following formula (1), where R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group that has 1 to 20 carbon atoms and may have a substituent, or an aryl group that has 6 to 20 carbon atoms and may have a substituent, and the substituent is at least one selected from a halogen atom, a hydroxy group, and a nitrile group.

    EPOXY RESIN COMPOSITION
    5.
    发明公开

    公开(公告)号:US20240301128A1

    公开(公告)日:2024-09-12

    申请号:US18565337

    申请日:2022-06-22

    CPC classification number: C08G59/223 C08G59/245 C08G59/50 C08G59/66

    Abstract: An epoxy material that provides a cured product having a reduced modulus of elasticity and thereby maintaining reliability even under conditions of wide environmental variation. The epoxy resin composition provided includes (A) an epoxy compound A of formula (1) below, (B) phenyl glycidyl ether substituted with a C6-20 hydrocarbon group, and (C) a curing agent. In formula (1), R1 and R2 each independently represent C2-4 alkylene; R3 represents methylene or —C(CH3)2—; and a and b each independently represent a number of 1 to 10.

    CURABLE RESIN COMPOSITION
    6.
    发明申请

    公开(公告)号:US20220185946A1

    公开(公告)日:2022-06-16

    申请号:US17436498

    申请日:2020-03-27

    Abstract: Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

    NOVEL COMPOUND, AND CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND

    公开(公告)号:US20240084065A1

    公开(公告)日:2024-03-14

    申请号:US18260554

    申请日:2022-01-25

    Inventor: Ken-ichi TAMASO

    CPC classification number: C08F283/10 C07D405/12 C08G59/145

    Abstract: An objective of the invention is to provide a material capable of obtaining a curable resin composition having an excellent balance between curability and storage stability. The invention is a compound represented by formula (1).




    In the formula, R1 to R4 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a hydroxy group, a nitro group, or a nitrile group; R5 to R7 each independently represent a hydrogen atom or a methyl group; and ring A represents (a1) or (a2) and forms a fused ring with the imide ring at *.

    EPOXY RESIN COMPOSITION
    8.
    发明申请

    公开(公告)号:US20180051167A1

    公开(公告)日:2018-02-22

    申请号:US15560773

    申请日:2016-03-22

    CPC classification number: C08L63/00 C08J5/24 C08K5/0066 C08K5/5399 C08L2201/02

    Abstract: An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a phosphorous-containing compound (C) indicated by the following general formula (1) and also, if necessary, a flame retardant (D), and a laminated plate comprising said resin composition; wherein m indicates an integer from 2 to 10, R1 to R4 each independently indicate a hydrogen atom, an alkyl group or an aryl group, R5 indicates a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X indicates an oxygen atom or a sulfur atom, Y indicates an oxygen atom, a sulfur atom or —NR6—, and R6 indicates a hydrogen atom, an alkyl group or an aryl group.

    PHOSPHORUS-CONTAINING COMPOUND AND CURING EPOXY RESIN COMPOSITION CONTAINING SAME
    9.
    发明申请
    PHOSPHORUS-CONTAINING COMPOUND AND CURING EPOXY RESIN COMPOSITION CONTAINING SAME 有权
    含磷化合物和固化含环氧树脂组合物

    公开(公告)号:US20160200747A1

    公开(公告)日:2016-07-14

    申请号:US14915766

    申请日:2014-11-10

    Abstract: Provided is a novel phosphorus-containing compound represented by general formula (I). The compound has reactivity with a glycidyl group and is therefore capable of providing a curing epoxy resin composition that is expected to achieve flame retardation and reduction of dielectric constant. wherein m is a number of 1 to 10; R1, R2, R3, and R4 are each hydrogen, alkyl, or aryl; R5 is alkyl, alkanediyl, alkanetriyl, alkanetetrayl, or an aromatic group; X is oxygen or sulfur; Y is oxygen, sulfur, or ═NR′; and R′ is hydrogen, alkyl, or aryl.

    Abstract translation: 提供通式(I)表示的新型含磷化合物。 该化合物与缩水甘油基具有反应性,因此能够提供期待实现阻燃和降低介电常数的固化环氧树脂组合物。 其中m为1至10的数; R 1,R 2,R 3和R 4各自为氢,烷基或芳基; R5是烷基,烷二基,链烷三基,烷基乙基或芳基; X是氧或硫; Y是氧,硫或= NRR; 和R'是氢,烷基或芳基。

    PHOSPHORUS-CONTAINING COMPOUND, AND CURABLE EPOXY RESIN COMPOSITION CONTAINING SAME
    10.
    发明申请
    PHOSPHORUS-CONTAINING COMPOUND, AND CURABLE EPOXY RESIN COMPOSITION CONTAINING SAME 审中-公开
    含有含磷的化合物和可固化的环氧树脂组合物

    公开(公告)号:US20160152643A1

    公开(公告)日:2016-06-02

    申请号:US14900844

    申请日:2014-08-21

    Abstract: The purpose of the present invention is to provide a phosphorus-containing compound having reactivity with a glycidyl group, specifically a phosphorus-containing compound represented by general formula (I). (In the formula, m represents a numerical value of 1 to 10; R1 and R2 independently represent a hydrogen atom, an alkyl group or an aryl group; R3 represents an alkyl group, an alkanediyl group, an alkanetriyl group, an alkanetetrayl group or an aromatic group; X represents an oxygen atom or a sulfur atom; Y represents an oxygen atom, a sulfur atom or —NR4—; and R4 represents a hydrogen atom, an alkyl group or an aryl group.)

    Abstract translation: 本发明的目的是提供一种与缩水甘油基具有反应性的含磷化合物,特别是由通式(I)表示的含磷化合物。 (式中,m表示1〜10的数值,R 1和R 2分别表示氢原子,烷基或芳基,R 3表示烷基,烷二基,烷三甲酰基,烷基四氟乙基, 芳基; X表示氧原子或硫原子; Y表示氧原子,硫原子或-NR4-,R4表示氢原子,烷基或芳基)。

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