Abstract:
A curing resin composition well balanced in curing properties and storage stability. The composition contains (A) an epoxy resin, (B) a curing agent, and (C) at least one of imide compounds represented by formulae (1-1), (1-2), and (1-3), wherein R11 represents an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.; R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, etc.; and R12 and R13 each independently represent a hydrogen atom, an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.
Abstract:
A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, R1 and R2 each independently express an alkyl group or an aryl group, R3 expresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or —NR4—, and in this regard, R4 expresses a hydrogen atom, an alkyl group or an aryl group.
Abstract:
An objective of the present invention is to provide an epoxy resin composition containing a reactive diluent capable of reducing viscosity while maintaining the epoxy resin's original properties as much as possible, and also capable of imparting novel additional effects such as adhesiveness, storage stability, etc. The invention relates to a one-pack type epoxy resin composition containing: component (A): a compound represented by general formula (1); component (B): an epoxy resin; and component (C): an amine-based curing agent. In the general formula (1), R1 represents a hydrogen atom or a methyl group; R2 and R3 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms; and n represents an integer of 1 to 3.
Abstract:
A clathrate compound obtained by mixing an imidazole compound (A) and a polyhydric phenol compound (B), wherein the clathrate compound has an average particle size (X) of 7 μm or less, and a maximum particle size (Y) of 40 μm or less. The imidazole compound (A) is preferably at least one selected from compounds represented by the following formula (1), where R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group that has 1 to 20 carbon atoms and may have a substituent, or an aryl group that has 6 to 20 carbon atoms and may have a substituent, and the substituent is at least one selected from a halogen atom, a hydroxy group, and a nitrile group.
Abstract:
An epoxy material that provides a cured product having a reduced modulus of elasticity and thereby maintaining reliability even under conditions of wide environmental variation. The epoxy resin composition provided includes (A) an epoxy compound A of formula (1) below, (B) phenyl glycidyl ether substituted with a C6-20 hydrocarbon group, and (C) a curing agent. In formula (1), R1 and R2 each independently represent C2-4 alkylene; R3 represents methylene or —C(CH3)2—; and a and b each independently represent a number of 1 to 10.
Abstract:
Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.
Abstract:
An objective of the invention is to provide a material capable of obtaining a curable resin composition having an excellent balance between curability and storage stability. The invention is a compound represented by formula (1).
In the formula, R1 to R4 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a halogen atom, a hydroxy group, a nitro group, or a nitrile group; R5 to R7 each independently represent a hydrogen atom or a methyl group; and ring A represents (a1) or (a2) and forms a fused ring with the imide ring at *.
Abstract:
An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a phosphorous-containing compound (C) indicated by the following general formula (1) and also, if necessary, a flame retardant (D), and a laminated plate comprising said resin composition; wherein m indicates an integer from 2 to 10, R1 to R4 each independently indicate a hydrogen atom, an alkyl group or an aryl group, R5 indicates a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X indicates an oxygen atom or a sulfur atom, Y indicates an oxygen atom, a sulfur atom or —NR6—, and R6 indicates a hydrogen atom, an alkyl group or an aryl group.
Abstract:
Provided is a novel phosphorus-containing compound represented by general formula (I). The compound has reactivity with a glycidyl group and is therefore capable of providing a curing epoxy resin composition that is expected to achieve flame retardation and reduction of dielectric constant. wherein m is a number of 1 to 10; R1, R2, R3, and R4 are each hydrogen, alkyl, or aryl; R5 is alkyl, alkanediyl, alkanetriyl, alkanetetrayl, or an aromatic group; X is oxygen or sulfur; Y is oxygen, sulfur, or ═NR′; and R′ is hydrogen, alkyl, or aryl.
Abstract:
The purpose of the present invention is to provide a phosphorus-containing compound having reactivity with a glycidyl group, specifically a phosphorus-containing compound represented by general formula (I). (In the formula, m represents a numerical value of 1 to 10; R1 and R2 independently represent a hydrogen atom, an alkyl group or an aryl group; R3 represents an alkyl group, an alkanediyl group, an alkanetriyl group, an alkanetetrayl group or an aromatic group; X represents an oxygen atom or a sulfur atom; Y represents an oxygen atom, a sulfur atom or —NR4—; and R4 represents a hydrogen atom, an alkyl group or an aryl group.)