CURABLE RESIN COMPOSITION
    1.
    发明申请

    公开(公告)号:US20210380749A1

    公开(公告)日:2021-12-09

    申请号:US17288372

    申请日:2019-11-07

    Abstract: Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

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