公开(公告)号：US20220282138A1

公开(公告)日：2022-09-08

申请号：US17687733

申请日：2022-03-07

Applicant: DENSO CORPORATION ,  ADEKA CORPORATION

Inventor： Kazuma YAMAGUCHI ,  Takao IZUMI ,  Keisuke OTA ,  Kohei HIRAYAMA ,  Shinsuke YAMADA ,  Ryo OGAWA

IPC: C09J163/00 ,  C09J11/04 ,  C09J11/06

Abstract: There is provided a photocurable adhesive having good deep-section curability. A photocurable adhesive is formulated to be curable by laser light irradiation. The photocurable adhesive contains an epoxy adhesive component and titanium black. The content of the titanium black is 1 ppm by mass or more and 150 ppm by mass or less relative to 100 parts by mass of the epoxy adhesive component. The titanium black may have a primary particle size of 5 nm or more and 150 nm or less.

公开(公告)号：US20160200860A1

公开(公告)日：2016-07-14

申请号：US14913431

申请日：2014-08-18

Applicant: ADEKA CORPORATION

Inventor： Ryo OGAWA ,  Takuya MATSUDA

IPC: C08G59/66 ,  C08G59/24

CPC classification number: C08G59/66 ,  C08G59/245 ,  C08G59/5073 ,  C08G59/56

Abstract: A one-component curable resin composition that does not contain an isocyanate compound, comprised of uniformly blended (A) a compound having two or more epoxy groups within a molecule, (B) a compound having two or more thiol groups within a molecule, and (C) an imidazole compound of formula (I), wherein the component (C) exists in the form of liquid.

Abstract translation: 不含有异氰酸酯化合物的单组分固化性树脂组合物，其包含在分子内均匀混合（A）具有两个以上环氧基的化合物，（B）分子内具有2个以上硫醇基的化合物，以及 （C）式（I）的咪唑化合物，其中组分（C）以液体的形式存在。

公开(公告)号：US20240141095A1

公开(公告)日：2024-05-02

申请号：US18547092

申请日：2022-02-08

Applicant: ADEKA CORPORATION

Inventor： Keisuke OTA ,  Kohei HIRAYAMA ,  Ryo OGAWA ,  Shinsuke YAMADA

IPC: C08G59/24 ,  C08G59/32 ,  C08G59/34 ,  C08G59/50 ,  C08G59/56 ,  C08K3/36 ,  C08K5/5419 ,  C08L61/14 ,  C09J163/08

CPC classification number: C08G59/245 ,  C08G59/3227 ,  C08G59/34 ,  C08G59/502 ,  C08G59/56 ,  C08K3/36 ,  C08K5/5419 ,  C08L61/14 ,  C09J163/08 ,  C08K2201/005 ,  C08L2205/025 ,  C08L2205/035

Abstract: Disclosed is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin essentially including at least a 4-amino-3-methylphenol-type epoxy resin; and (C) a latent curing agent. Preferably, the cyanate ester resin (A) is at least one selected from the group consisting of compounds represented by formula (1) below, compounds represented by formula (2) below, and at least one of polymer of these compounds. Formula (1): NC—O-A1-Y1-A2-O—CN (See the Description for the symbols in the formula). Formula (2): (See the Description for the symbols in the formula).

公开(公告)号：US20240109869A1

公开(公告)日：2024-04-04

申请号：US18262337

申请日：2022-01-25

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Yasuyuki MORI ,  Ippei OKANO ,  Ryo OGAWA ,  Junji UEYAMA

IPC: C07D403/06 ,  C08G59/50 ,  H01B1/12

CPC classification number: C07D403/06 ,  C08G59/5073 ,  H01B1/121

Abstract: Disclosed is a charge transfer complex capable of obtaining a curable resin composition having an excellent balance between curability and storage stability when used as an epoxy-resin curing agent. The charge transfer complex has an imidazole moiety as an electron donor moiety. The charge transfer complex may be an assembly wherein electrons included in a compound (a) having an imidazole moiety are accepted by a compound (b) having an electron acceptor moiety, or may be a compound having an imidazole moiety and an electron acceptor moiety in its molecule, and the electron acceptor moiety accepts electrons included in the imidazole moiety.

公开(公告)号：US20240317967A1

公开(公告)日：2024-09-26

申请号：US18262521

申请日：2022-01-25

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Yasuyuki MORI ,  Ken-ichi TAMASO ,  Ryo OGAWA ,  Junji UEYAMA

IPC: C08K5/3415 ,  C08G59/50

CPC classification number: C08K5/3415 ,  C08G59/5073

Abstract: A curing resin composition well balanced in curing properties and storage stability. The composition contains (A) an epoxy resin, (B) a curing agent, and (C) at least one of imide compounds represented by formulae (1-1), (1-2), and (1-3), wherein R11 represents an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.; R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, etc.; and R12 and R13 each independently represent a hydrogen atom, an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.

公开(公告)号：US20180037014A1

公开(公告)日：2018-02-08

申请号：US15547090

申请日：2016-01-26

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Kozo MATSUMOTO ,  Ken-ichi TAMASO ,  Chihiro ASAKURA ,  Ryo OGAWA

IPC: B32B27/38 ,  C08L63/00 ,  C08G59/40 ,  C08K5/5313 ,  B32B27/26 ,  C08K5/00

Abstract: A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, R1 and R2 each independently express an alkyl group or an aryl group, R3 expresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or —NR4—, and in this regard, R4 expresses a hydrogen atom, an alkyl group or an aryl group.

公开(公告)号：US20240141094A1

公开(公告)日：2024-05-02

申请号：US18547066

申请日：2022-02-08

Applicant: ADEKA CORPORATION

Inventor： Kohei HIRAYAMA ,  Keisuke OTA ,  Ryo OGAWA ,  Shinsuke YAMADA

IPC: C08G59/24 ,  C08G59/28 ,  C08G59/34 ,  C08G59/50 ,  C08G59/56 ,  C08K3/08 ,  C08K3/36 ,  C08L61/14 ,  C09J163/08

CPC classification number: C08G59/245 ,  C08G59/28 ,  C08G59/34 ,  C08G59/502 ,  C08G59/56 ,  C08K3/08 ,  C08K3/36 ,  C08L61/14 ,  C09J163/08 ,  C08K2003/0812 ,  C08K2201/003 ,  C08L2205/025 ,  C08L2205/035

Abstract: A curing resin composition including (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen-containing amine latent curing agent, and (D) an ion scavenger. The cyanate ester resin (A) is preferably at least one of a compound of formula (1) below, a compound of formula (2) below, and a polymer of at least one of these compounds (1) and (2).


NC—O-A1-Y1-A2-O—CN  (1)

wherein the symbols are as defined in the description.






wherein the symbols are as defined in the description.

公开(公告)号：US20220185946A1

公开(公告)日：2022-06-16

申请号：US17436498

申请日：2020-03-27

Applicant: ADEKA CORPORATION

Inventor： Shota KOBAYASHI ,  Ken-ichi TAMASO ,  Ryo OGAWA ,  Tamotsu NAGAMATSU

IPC: C08G59/24 ,  C08G59/40 ,  C08G59/56 ,  C08G59/66 ,  C08G59/68 ,  B29C71/02 ,  C08J7/12

Abstract: Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.

公开(公告)号：US20210380749A1

公开(公告)日：2021-12-09

申请号：US17288372

申请日：2019-11-07

Applicant: ADEKA CORPORATION

Inventor： Keisuke OTA ,  Masato INADOME ,  Yukako ISHIGAMI ,  Ryo OGAWA ,  Tamotsu NAGAMATSU

IPC: C08G18/00 ,  C08G18/48 ,  C09J175/08 ,  C08G18/10 ,  C08G18/28

Abstract: Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

公开(公告)号：US20160333138A1

公开(公告)日：2016-11-17

申请号：US15111937

申请日：2015-01-22

Applicant: ADEKA CORPORATION

Inventor： Takeshi ENDO ,  Kozo MATSUMOTO ,  Daisuke SATO ,  Ryo OGAWA

IPC: C08G59/50 ,  C07D239/06 ,  C07D235/08 ,  C07D233/58

CPC classification number: C08G59/5073 ,  C07D233/58 ,  C07D235/06 ,  C07D235/08 ,  C07D239/06 ,  C07D249/08 ,  C07D251/14 ,  C08L63/00

Abstract: An epoxy resin composition excellent in storage stability and curability is provided. Particularly, a compound of general formula (I) and an epoxy resin composition containing the compound as a curing agent are provided. In formula (I), R1 is a hydrocarbon group optionally containing a nitrogen atom and capable of forming a cyclic structure optionally having a substituent; R2 is a hydrogen atom, an alkyl group, or an aryl group or is taken together with R1 to form an unsaturated bond; R3 is a hydrogen atom, an alkyl group, or an aryl group; and X is a dicyanamide ion or a thiocyanate ion.

Abstract translation: 在式（I）中，R 1是任选地含有氮原子并能够形成任选具有取代基的环状结构的烃基; R2是氢原子，烷基或芳基，或者与R1一起形成不饱和键; R3是氢原子，烷基或芳基; X是二氰胺离子或硫氰酸根离子。