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    Electronic Device Having Antenna with Vent Structures
    2.
    发明公开
    Electronic Device Having Antenna with Vent Structures 审中-公开

    公开(公告)号：US20240079785A1

    公开(公告)日：2024-03-07

    申请号：US18458811

    申请日：2023-08-30

    Applicant: Apple Inc.

    Inventor： Yiren Wang ,  Yuan Tao ,  Hao Xu ,  Yuancheng Xu ,  Enrique Ayala Vazquez ,  Nikolaj P. Kammersgaard ,  Eric W. Bates ,  Peter A. Dvorak ,  Victor C. Lee ,  Han Wang

    IPC: H01Q9/04

    CPC classification number: H01Q9/0421 ,  H01Q1/243

    Abstract: An electronic device may be provided with an antenna having a resonating element formed from a segment of peripheral conductive housing structures. A speaker may be aligned with first openings in the segment. A vent may be aligned with second openings in the segment. A connector may protrude through the segment. A trace combiner for the antenna may be patterned onto the speaker and may be coupled to the segment. Tuners for the antenna may be disposed on first and second flexible printed circuits that extend along opposing sides of the connector. The tuners may be controlled through the speaker. The second flexible printed circuit may extend along the vent. The vent may have a vent cowling with a cut-out region next to the tuner on the second flexible printed circuit.

    Electronic Device with Antenna Grounding Through Sensor Module
    3.
    发明公开
    Electronic Device with Antenna Grounding Through Sensor Module 审中-公开

    公开(公告)号：US20240079779A1

    公开(公告)日：2024-03-07

    申请号：US18458779

    申请日：2023-08-30

    Applicant: Apple Inc.

    Inventor： Yuan Tao ,  Yiren Wang ,  Ana Papio Toda ,  Jingni Zhong ,  Han Wang ,  Hao Xu ,  Hongfei Hu ,  Mattia Pascolini ,  Eric W. Bates ,  Peter A. Dvorak ,  Allegra Shum

    IPC: H01Q5/328 ,  H01Q9/04

    CPC classification number: H01Q5/328 ,  H01Q9/0442

    Abstract: An electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. The tuner may be mounted to a printed circuit overlapping the sensor module. A spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. The sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. Conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. This may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.

    3D flex soldering
    7.
    发明授权
    3D flex soldering 有权
    3D柔性焊接

    公开(公告)号：US09538662B2

    公开(公告)日：2017-01-03

    申请号：US14574191

    申请日：2014-12-17

    Applicant: Apple Inc.

    Inventor： Richard A. Besen ,  Eric W. Bates ,  Gregory N. Stephens

    IPC: H04M1/00 ,  H05K1/18 ,  H01R12/00 ,  H05K3/34

    CPC classification number: H05K1/189 ,  H01R12/00 ,  H05K3/3431 ,  H05K3/3436 ,  H05K2201/10189 ,  H05K2201/10333 ,  H05K2201/2036 ,  Y02P70/613

    Abstract: In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.

    Abstract translation: 在某些设计中，使柔性电路（flex）呈现弯曲状态可有助于有效地布线导电通路。 在回流操作期间实现弯曲状态下的弯曲焊接的一种有效方式是操纵镶板，其将多个弯曲部分保持在可弯曲的位置，以可靠地保持弯曲。 在一些实施例中，柔性件可以在回流操作期间表面安装到电气设备的一部分或全部，在此期间，弯曲状态通过至少部分地附接到柔性件的周边的镶板来保持。 另一个解决方案是在表面安装和回流操作期间利用真空或热胶装置来保持弯曲。

    Component Protection Structures for Electronic Devices
    8.
    发明申请
    Component Protection Structures for Electronic Devices 有权
    电子元器件保护结构

    公开(公告)号：US20160066438A1

    公开(公告)日：2016-03-03

    申请号：US14801686

    申请日：2015-07-16

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Sawyer I. Cohen ,  Scott A. Myers ,  Tyler B. Cater ,  Eric W. Bates

    IPC: H05K5/00 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/181 ,  G06F1/1658 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10598 ,  Y02P70/611

    Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

    Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 电气部件可以包括热传感器和压力传感器。 印刷电路中的通孔可以接收支架的轴。支座可以焊接到通孔侧面的电镀金属。 螺钉或其他紧固件可将印刷电路固定到电子设备的外壳。 可以将环形金属构件焊接到印刷电路。 环形金属构件可以形成围绕螺钉或其他紧固件和热传感器的保险杠。 压力传感器可以具有通过其进行环境压力测量的端口。 诸如织物或其它多孔层的防尘罩可以覆盖端口。

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