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    Display With Vias to Access Driver Circuitry
    1.
    发明申请
    Display With Vias to Access Driver Circuitry 审中-公开
    显示与通道访问驱动器电路

    公开(公告)号：US20160329386A1

    公开(公告)日：2016-11-10

    申请号：US15091333

    申请日：2016-04-05

    Applicant: Apple Inc.

    Inventor： Jason C. Sauers ,  Jean-Pierre S. Guillou ,  Peter J. Kardassakis ,  Shaowei Qin ,  Yi Tao

    IPC: H01L27/32 ,  H01L51/56 ,  H01L51/00 ,  H01L51/52

    CPC classification number: H01L51/0097 ,  H01L27/3276 ,  H01L51/56 ,  Y02E10/549

    Abstract: A thin-film transistor layer, an organic light-emitting diode layer, and other layers may be used in forming an array of pixels on a substrate in a display. Vias may be formed through one or more layers of the display such as the substrate layer to form vertical signal paths. The vertical signal paths may convey signals between display driver circuitry underneath the display and the pixels. The vias may pass through a polymer layer and may contact pads formed within openings in the substrate. Vias may pass through a glass support layer. Metal traces may be formed in the thin-film transistor layer to create signal paths such as data lines and gate lines. Portions of the metal traces may form vias through a polymer layer such as a substrate layer or a polymer layer that has been formed on top of the substrate layer.

    Abstract translation: 可以使用薄膜晶体管层，有机发光二极管层等层来形成显示器中的基板上的像素阵列。 可以通过诸如衬底层的显示器的一个或多个层来形成通孔，以形成垂直信号路径。 垂直信号路径可以在显示器下方的显示驱动器电路和像素之间传送信号。 通孔可以穿过聚合物层并且可以接触形成在基底中的开口内的垫。 通孔可以通过玻璃支撑层。 可以在薄膜晶体管层中形成金属迹线以产生诸如数据线和栅极线的信号路径。 金属迹线的一部分可以通过聚合物层形成通孔，例如基底层或已形成在基底层顶部上的聚合物层。

    Display System and Rigid Flex PCB with Flip Chip Bonded Inside Cavity
    3.
    发明申请
    Display System and Rigid Flex PCB with Flip Chip Bonded Inside Cavity 有权

    公开(公告)号：US20210084777A1

    公开(公告)日：2021-03-18

    申请号：US16912522

    申请日：2020-06-25

    Applicant: Apple Inc.

    Inventor： Adam Adjiwibawa ,  Shaowei Qin ,  Victor H. Yin ,  Wenyong Zhu ,  Steven M. Scardato

    IPC: H05K3/46

    Abstract: A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel.

    Display system and rigid flex PCB with flip chip bonded inside cavity
    5.
    发明授权
    Display system and rigid flex PCB with flip chip bonded inside cavity 有权

    公开(公告)号：US11129284B2

    公开(公告)日：2021-09-21

    申请号：US16912522

    申请日：2020-06-25

    Applicant: Apple Inc.

    Inventor： Adam Adjiwibawa ,  Shaowei Qin ,  Victor H. Yin ,  Wenyong Zhu ,  Steven M. Scardato

    IPC: H05K1/00 ,  H05K3/46

    Abstract: A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel.

    Display with vias to access driver circuitry
    6.
    发明授权
    Display with vias to access driver circuitry 有权

    公开(公告)号：US10170711B2

    公开(公告)日：2019-01-01

    申请号：US15091333

    申请日：2016-04-05

    Applicant: Apple Inc.

    Inventor： Jason C. Sauers ,  Jean-Pierre S. Guillou ,  Peter J. Kardassakis ,  Shaowei Qin ,  Yi Tao

    IPC: H01L27/32 ,  H01L51/00 ,  H01L51/56

    Abstract: A thin-film transistor layer, an organic light-emitting diode layer, and other layers may be used in forming an array of pixels on a substrate in a display. Vias may be formed through one or more layers of the display such as the substrate layer to form vertical signal paths. The vertical signal paths may convey signals between display driver circuitry underneath the display and the pixels. The vias may pass through a polymer layer and may contact pads formed within openings in the substrate. Vias may pass through a glass support layer. Metal traces may be formed in the thin-film transistor layer to create signal paths such as data lines and gate lines. Portions of the metal traces may form vias through a polymer layer such as a substrate layer or a polymer layer that has been formed on top of the substrate layer.

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