公开(公告)号：US09715964B2

公开(公告)日：2017-07-25

申请号：US14500786

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： Gang Ning ,  Pradeep Vengavasi ,  Linda Y. Dunn ,  Yonas A. Hartanto ,  Shawn X. Arnold

IPC: H01G2/22 ,  H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H01G4/12

CPC classification number: H01G2/22 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

Abstract: This disclosure describes methods and systems for minimizing electromagnetic interference (EMI) noise emanating from a ceramic capacitor. The ceramic capacitor may include several terminations are on a bottom portion of the capacitor. The capacitor may be designed to include several capacitors formed from electrode layers. The capacitor may include a conductive coating on an outer peripheral portion. The coating may include conductive materials such as Cu, Ni, Ag, and/or graphite. Alternatively, some regions of the capacitor may include electrode layers built into the capacitor that are not associated with capacitors. In this manner, the ceramic capacitor may be free of the conductive coating to locations proximate to the described electrode layers not associated with capacitors. The conductive coating can act as an electromagnetic shielding to prevent the EMI noise from emanating outside the electromagnetic shielding. Also, the conductive coating can be electrically grounded (e.g., to printed circuit board) via terminals.

公开(公告)号：US20150364255A1

公开(公告)日：2015-12-17

申请号：US14500786

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： Gang Ning ,  Pradeep Vengavasi ,  Linda Y. Dunn ,  Yonas A. Hartanto ,  Shawn X. Arnold

IPC: H01G2/22 ,  H01G4/30 ,  H01G2/06 ,  H01G4/12

CPC classification number: H01G2/22 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

Abstract: This disclosure describes methods and systems for minimizing electromagnetic interference (EMI) noise emanating from a ceramic capacitor. The ceramic capacitor may include several terminations are on a bottom portion of the capacitor. The capacitor may be designed to include several capacitors formed from electrode layers. The capacitor may include a conductive coating on an outer peripheral portion. The coating may include conductive materials such as Cu, Ni, Ag, and/or graphite. Alternatively, some regions of the capacitor may include electrode layers built into the capacitor that are not associated with capacitors. In this manner, the ceramic capacitor may be free of the conductive coating to locations proximate to the described electrode layers not associated with capacitors. The conductive coating can act as an electromagnetic shielding to prevent the EMI noise from emanating outside the electromagnetic shielding. Also, the conductive coating can be electrically grounded (e.g., to printed circuit board) via terminals.

Abstract translation: 本公开描述了用于最小化从陶瓷电容器发出的电磁干扰（EMI）噪声的方法和系统。 陶瓷电容器可以包括位于电容器底部的多个端子。 电容器可以被设计成包括由电极层形成的多个电容器。 电容器可以包括外周部分上的导电涂层。 涂层可以包括诸如Cu，Ni，Ag和/或石墨的导电材料。 或者，电容器的一些区域可以包括内置于不与电容器相关联的电容器中的电极层。 以这种方式，陶瓷电容器可以没有导电涂层到靠近所描述的与电容器不相关的电极层的位置。 导电涂层可以作为电磁屏蔽，以防止EMI噪声发散在电磁屏蔽外。 此外，导电涂层可以通过端子电接地（例如，到印刷电路板）。