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公开(公告)号：US20220356328A1
公开(公告)日：2022-11-10
申请号：US17754331
申请日：2020-10-07
Applicant: BASF SE
Inventor： Lin CHEN , Wen LU , Suresh PARAPPUVEETIL SARANGADHARAN , Fu Chin CHUANG
IPC: C08K13/02
Abstract: Disclosed herein is a polyamide composition, and an article which is obtained or obtainable from the composition. The article may include a connector socket for Double Data Rate 5 RAM. The polyamide composition disclosed herein shows desirable tensile strength for the article at a thickness of 0.4 mm, good flowability, and high HDT. The composition also exhibits good thermal stability during molding, and approaches UL 94 V-0.
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