公开(公告)号：US20220356328A1

公开(公告)日：2022-11-10

申请号：US17754331

申请日：2020-10-07

Applicant: BASF SE

Inventor： Lin CHEN ,  Wen LU ,  Suresh PARAPPUVEETIL SARANGADHARAN ,  Fu Chin CHUANG

IPC: C08K13/02

Abstract: Disclosed herein is a polyamide composition, and an article which is obtained or obtainable from the composition. The article may include a connector socket for Double Data Rate 5 RAM. The polyamide composition disclosed herein shows desirable tensile strength for the article at a thickness of 0.4 mm, good flowability, and high HDT. The composition also exhibits good thermal stability during molding, and approaches UL 94 V-0.

公开(公告)号：US20200157699A1

公开(公告)日：2020-05-21

申请号：US16616353

申请日：2018-05-17

Applicant: BASF SE

Inventor： Sebastian Wagner ,  Simon Kniesel ,  Wen LU ,  Tobias Urban ,  Frank Richter

IPC: C25D5/56 ,  C23C18/24 ,  C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  C08L77/00 ,  C08L39/06 ,  C08L31/04 ,  C08K3/013

Abstract: An article including a polymer body and a metal plating is provided. In this article, the metal plating is attached to the polymer body and the polymer body includes as components at least one polyamide (A), at least one filler (B), at least one poly-N-vinyllactam polymer (C) and, optionally, at least one additive (D). Also provided is the process for producing this article and the use of this article e.g. as a door handle in automotive applications. Further provided is the use of the polymer body for producing metal-plated articles.