公开(公告)号：US20240011678A1

公开(公告)日：2024-01-11

申请号：US18002235

申请日：2021-06-07

Applicant: BYD COMPANY LIMITED

Inventor： Yonghui LI ,  Junqiao LI ,  Wei ZHOU

IPC: F25B21/02 ,  H01L23/38 ,  H10N19/00

CPC classification number: F25B21/02 ,  H01L23/38 ,  H10N19/00

Abstract: A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.